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CHP Datasheet(PDF) 1 Page - TT Electronics.

Part # CHP
Description  Cylindrical High Power
PDF  4 Pages
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Manufacturer  TTELEC [TT Electronics.]
Direct Link  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

CHP Datasheet(HTML) 1 Page - TT Electronics.

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General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
© IRC Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal GlazeTM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
High
temperature
dielectric
coating
Electrical Data
• Up to 2 watts
• Up to 1000 volts
• 0.2 ohm to 2.2 megohm range
• RoHS-compliant version available
• 150°C maximum operating temperature
Environmental Data
IRC
Type
Indus-
try
Foot-
print
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
Product
Category
Tolerance
(±%)³
TCR
(ppm/°C)³
CHP 1/8
1206
B & C
1/4W @ 70°C
200
400
0.1 to 0.99
Low Range
1, 2, 5
100
1.0 to 1.0 M
Standard
1, 2, 5
50, 100
20 to 348K
Tight Tolerance
0.25, 0.5
50, 100
CHP 1/2
2010
D & E
1/2W @ 70°C
300
600
0.1 to 0.99
Low Range
1, 2, 5
100
1.0 to 348K
Standard
1, 2, 5
50, 100
CHP 1
2512
F
1W @ 70°C
350
700
0.1 to 0.99
Low Range
1, 2, 5
100
1.0 to 2.21M
Standard
1, 2, 5
50, 100
20 to 348K
Tight Tolerance
0.25, 0.5
50, 100
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
Low Range
1, 2, 5
100
1.0 to 2.21M
Standard
1, 2, 5
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
²Not to exceed P x R
³Consult factory for tighter TCR, tolerance, or resistance values.
√
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Temperature Coefficient
As specified
MIL-R-55342H Par 3.16 (-55°C + 125°C)
P x R
Thermal Shock
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
Low Temperature Operation
±0.25% + 0.01 ohm
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
Short Time Overload
±0.5% + 0.01 ohm
±1% for R>100K ohm
MIL-R-55342H Par 3.12
High Temperature Exposure
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
Resistance to Bonding
±0.25% + 0.01 ohm
MIL-R-55342H Par 3.14.2 (Reflow soldered to board at 260°C for 10 seconds)
Exposure
95% minimum coverage
MIL-STD-202, Method 208 (245°C for 5 seconds)
Solderability
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
Moisture Resistance
±0.5% + 0.01 ohm
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
Life Test
Terminal Adhesion Strength
±1% + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for 60 seconds
±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected 1mm so as to
exert pull on chip contacts for 5 seconds
√
CHP
Cylindrical High Power
Surface Mount Metal GlazeTM
CHP Series Issue March 2011 Sheet 1 of 3
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
Upto2watts
Upto1000volts
0.2 ohm to 2.2 megohm range
RoHS-compliantversionavailable
150°Cmaximumoperatingtemperature
AEC-Q200
Metal Glaze™
thickfilmelement
firedat1000°C
tosolidceramic
High
temperature
dielectric
coating
Solderover
nickelbarrier
Characteristics
Maximum Change
Test Method
Thermal Shock
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.3
(MIL-STD-202, Method 107G: +150°C / -65°C)
Low Temperature Operation
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.5
(-65°C)
Short Time Overload
±0.5% +.01 Ω
±1% for R>100KΩ
MIL-PRF-55342H, §4.8.6
High Temperature Exposure
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.7
(150°C x 100 Hours)
Resistance to Bonding Exposure
±0.25% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
Moisture Resistance
±0.5% +.01 Ω
MIL-PRF-55342H, §4.8.8.2
(MIL-STD-202, Method 106G)
Temperature Coefficient
As specified
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
Life Test
±1% +.01 Ω
MIL-PRF-55342H, §4.8.11
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
Solderability
95% minimum coverage
MIL-PRF-55342H, §4.8.12
(MIL-STD-202, Method 208H)
Terminal Adhesion Strength (push) ±1% +.01 Ω
(no mechanical damage)
IRC – defined
1200 gram push from underside of mounted device for 60 sec
Terminal Adhesion Strength (flex)
±1% +.01 Ω
(no mechanical damage)
IRC-defined
Device mounted in center of 90mm long board, deflected 1 mm to exert
pull on contacts for 5 seconds
Resistors
AllPb-freepartscomplywithEUDirective2011/65/EU(RoHS2)
05.17
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
http://www.ttelectronics.com/resistors
BI Technologies IRC Welwyn


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