| Electronic Components Datasheet Search |
|
CHP Datasheet(PDF) 1 Page - TT Electronics. |
|
|
|||||||||||||||||||||||||||||
CHP Datasheet(HTML) 1 Page - TT Electronics. |
|
1 / 4 page ![]() 2.5 x for 5 seconds General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA © IRC Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal GlazeTM thick film element fired at 1000°C to solid ceramic Solder over nickel barrier High temperature dielectric coating Electrical Data • Up to 2 watts • Up to 1000 volts • 0.2 ohm to 2.2 megohm range • RoHS-compliant version available • 150°C maximum operating temperature Environmental Data IRC Type Indus- try Foot- print Size Code1 Maximum Power Rating Working Voltage² Maximum Voltage Resistance Range (ohms)³ Product Category Tolerance (±%)³ TCR (ppm/°C)³ CHP 1/8 1206 B & C 1/4W @ 70°C 200 400 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 1.0 M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 CHP 1/2 2010 D & E 1/2W @ 70°C 300 600 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 348K Standard 1, 2, 5 50, 100 CHP 1 2512 F 1W @ 70°C 350 700 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 2.21M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 CHP 2 3610 H 2W @ 25°C 1.33W @ 70°C 500 1000 0.2 to 0.99 Low Range 1, 2, 5 100 1.0 to 2.21M Standard 1, 2, 5 50, 100 ¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging. ²Not to exceed P x R ³Consult factory for tighter TCR, tolerance, or resistance values. √ d o h t e M t s e T e g n a h C m u m i x a M s c i t s i r e t c a r a h C Temperature Coefficient As specified MIL-R-55342H Par 3.16 (-55°C + 125°C) P x R Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342H Par 3.11 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342H Par 3.12 High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342H Par 3.13 (-150°C for 100 hours) Resistance to Bonding ±0.25% + 0.01 ohm MIL-R-55342H Par 3.14.2 (Reflow soldered to board at 260°C for 10 seconds) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Solderability ±0.5% + 0.01 ohm MIL-R-55342H Par 3.18 (10 cycles, total 240 hours) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent) Life Test Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 1mm so as to exert pull on chip contacts for 5 seconds √ CHP Cylindrical High Power Surface Mount Metal GlazeTM CHP Series Issue March 2011 Sheet 1 of 3 Cylindrical High Power Surface Mount Metal Glaze™ CHP Series Upto2watts Upto1000volts 0.2 ohm to 2.2 megohm range RoHS-compliantversionavailable 150°Cmaximumoperatingtemperature AEC-Q200 Metal Glaze™ thickfilmelement firedat1000°C tosolidceramic High temperature dielectric coating Solderover nickelbarrier Characteristics Maximum Change Test Method Thermal Shock ±0.25% +.01 Ω MIL-PRF-55342H, §4.8.3 (MIL-STD-202, Method 107G: +150°C / -65°C) Low Temperature Operation ±0.25% +.01 Ω MIL-PRF-55342H, §4.8.5 (-65°C) Short Time Overload ±0.5% +.01 Ω ±1% for R>100KΩ MIL-PRF-55342H, §4.8.6 High Temperature Exposure ±0.5% +.01 Ω MIL-PRF-55342H, §4.8.7 (150°C x 100 Hours) Resistance to Bonding Exposure ±0.25% +.01 Ω MIL-PRF-55342H, §4.8.8.2 Moisture Resistance ±0.5% +.01 Ω MIL-PRF-55342H, §4.8.8.2 (MIL-STD-202, Method 106G) Temperature Coefficient As specified MIL-PRF-55342H, §4.8.10 (MIL-STD-202, Method 304) Life Test ±1% +.01 Ω MIL-PRF-55342H, §4.8.11 (MIL-STD-202, Method 108A: 2000 Hours @ 70°C) Solderability 95% minimum coverage MIL-PRF-55342H, §4.8.12 (MIL-STD-202, Method 208H) Terminal Adhesion Strength (push) ±1% +.01 Ω (no mechanical damage) IRC – defined 1200 gram push from underside of mounted device for 60 sec Terminal Adhesion Strength (flex) ±1% +.01 Ω (no mechanical damage) IRC-defined Device mounted in center of 90mm long board, deflected 1 mm to exert pull on contacts for 5 seconds Resistors AllPb-freepartscomplywithEUDirective2011/65/EU(RoHS2) 05.17 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc http://www.ttelectronics.com/resistors BI Technologies IRC Welwyn |
Similar Part No. - CHP |
|
Similar Description - CHP |
|
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |