SMD22PL

THRU

Schottky Barrier

Diodes

20 to 100 Volts

Features

•

Low Profile Package

Symbol

Parameter

Rating

Unit

Maximum RMS Voltage

SMD22PL

SMD24PL

14

28

V

Repetitive Peak Reverse Voltage SMD22PL

SMD24PL

20

40

V

Rectified Current (Average) Half Wave

2.0

A

Surge Forward Current,halfsine wave 8.3ms

50

A

Temperature

Electrical Characteristics @ 25

Symbol

Parameter

Min

Typ

Max

Units

Forward Voltag

SMD22PL~24PL

SMD26PL

---

---

---

---

0.50

0.70

V

@f=1.0MHz,Vr=4V

---

210

---

pF

omponents

20736 Marilla

Street Chatsworth



 !"#

$%    !"#

0.036”

0.093”

0.048”

SUGGESTED SOLDER

PAD LAYOUT

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

B

E

C

D

H

G

SOD-123FL

SMD210PL

Maximum Ratings

M

echanical Data

•

Packaging: SOD-123FL

•

Marking Code: SMD22PL---M2; SMD24PL---M4; SMD26PL---M6

SMD28PL---M8; SMD210PL---M10;

SMD26PL

SMD28PL

SMD210PL

SMD26PL

SMD28PL

SMD210PL

60

80

100

42

56

70

Typical Thermal Resistance

(Note2)

60

30

21

Power Dissipation

1.68

W

SMD28PL~210PL

0.85

---

---

Maximum DC Reverse Current

0.5

mA

---

---

Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.

•

Epoxy meets UL 94 V-0 flammability rating

•

Moisture Sensitivity Level 1

•

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

A

.140

.152

3.55

3.85

B

.100

.122

2.55

3.10

C

.055

.075

1.40

1.90

D

.035

.053

0.90

1.35

E

.020

.041

0.50

1.05

G

.010

-----

0.25

-----

H

-----

.010

----

.25

•

Halogen free available upon request by adding suffix "-HF"

•

•

Low Forward Voltage

2. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.

(@2A dc)

-65 to +125

SMD22PL~SMD2

4PL

SMD2

6PL~SMD210PL

-65 to +150

Junction and Storage

Micro Commercial Components

M C C

R

Revision:

E

20

17/04/01

1 of 3