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PMEG2005EB Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PMEG2005EB
Description  20 V, 1 A ultra low VF MEGA Schottky barrier rectifier in SOD523 package
PDF  8 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PMEG2005EB Datasheet(HTML) 3 Page - NXP Semiconductors

  PMEG2005EB Datasheet HTML 1Page - NXP Semiconductors PMEG2005EB Datasheet HTML 2Page - NXP Semiconductors PMEG2005EB Datasheet HTML 3Page - NXP Semiconductors PMEG2005EB Datasheet HTML 4Page - NXP Semiconductors PMEG2005EB Datasheet HTML 5Page - NXP Semiconductors PMEG2005EB Datasheet HTML 6Page - NXP Semiconductors PMEG2005EB Datasheet HTML 7Page - NXP Semiconductors PMEG2005EB Datasheet HTML 8Page - NXP Semiconductors  
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2003 Dec 03
3
Philips Semiconductors
Product specification
20 V, 1 A ultra low VF MEGA Schottky
barrier rectifier in SOD523 package
PMEG2010AEB
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. For Schottky barrier rectifiers, thermal run-away has to be considered, as in some applications the reverse power
losses PR are a significant part of the total power losses. Nomograms for determination of the reverse power losses
PR and IF(AV) rating will be available on request.
THERMAL CHARACTERISTICS
Notes
1. Refer to SOD523 (SC-79) standard mounting conditions.
2. For Schottky barrier rectifiers, thermal run-away has to be considered, as in some applications the reverse power
losses PR are a significant part of the total power losses. Nomograms for determination of the reverse power losses
PR and IF(AV) rating will be available on request.
3. Solder point of cathode tab.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
continuous reverse voltage
−
20
V
IF
continuous forward current
Ts ≤ 55 °C
−
1.0
A
IFRM
repetitive peak forward current
tp ≤ 1 ms; δ≤ 0.5
−
3.5
A
IFSM
non-repetitive peak forward current
t = 8 ms square wave
−
6A
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
note 1
−
150
°C
Tamb
operating ambient temperature
note 1
−65
+150
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to
ambient
in free air; notes 1 and 2
400
K/W
Rth(j-s)
thermal resistance from junction to
soldering point
notes 2 and 3
75
K/W



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