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S10GL Datasheet(PDF) 1 Page - Micro Commercial Components |
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S10GL Datasheet(HTML) 1 Page - Micro Commercial Components |
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1 / 4 page ![]() Features x Glass Passivated Chip x High Temp Soldering: 260qC for 10 Seconds At Terminals S10AL S10AL 50V 35V 50V S10BL S10BL 100V 70V 100V S10DL S10DL 200V 140V 200V S10GL S10GL 400V 280V 400V S10JL S10JL 600V 420V 600V S10KL S10KL 800V 560V 800V S10ML S10ML 1000V 700V 1000V Electrical Characteristics @ 25 qC Unless Otherwise Specified Average Forward Current IF(AV) 10.0A TC = 75qC Peak Forward Surge Current IFSM 200A 8.3ms, half sine Maximum Instantaneous Forward Voltage VF 1.20V IFM = 10.0A; TJ = 25qC* Maximum DC Reverse Current At Rated DC Blocking Voltage IR 10PATJ = 25qC *Pulse test: Pulse width 200 Psec, Duty cycle 2% omponents 20736 Marilla Street Chatsworth !"# $% !"# • Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) Note1 : High Temperature Solder Exemptions Applied, see EU Directive Annex 7. x Operating Temperature: -55qC to +150qC x Storage Temperature: -55qC to +150qC MCC Part Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage x Maximum Thermal Resistance; 18qC/W Junction To Lead Revision: E 2017/04/12 www.mccsemi.com 1 of 4 • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 0.125” SUGGESTED SOLDER PAD LAYOUT DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .079 .103 2.00 2.62 B .108 .128 2.75 3.25 C .002 .008 0.051 0.203 D .006 .012 0.152 0.305 E .030 .060 0.76 1.52 F ..305 .320 7.75 8.13 G .260 .280 6.60 7.11 H .220 .245 5.59 6.22 G H E D F 0.070” 0.190 A B C Rectifier 50 - 1000 Volts 10 Amp Surface Mount Glass Passivated S10AL THRU S10ML SMC (DO-214AB) • Halogen free available upon request by adding suffix "-HF" Maximum Ratings Micro Commercial Components M C C R • Typical Thermal Resistance: 17°C/W Junction to Case 47°C/W Junction to Ambient 13°C/W Junction to Lead I t Rating for fusing 2 I t 2 (t<8.3ms) 166A2S |
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