Electronic Components Datasheet Search
  English  ▼

X  

RT9237 Datasheet(PDF) 12 Page - List of Unclassifed Manufacturers

Part # RT9237
Description  MULTI-PHASE DC/DC CONTROLLER FOR CPU CORE POWER SUPPLY
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ETC [List of Unclassifed Manufacturers]
Direct Link  
Logo ETC - List of Unclassifed Manufacturers

RT9237 Datasheet(HTML) 12 Page - List of Unclassifed Manufacturers

Back Button RT9237 Datasheet HTML 7Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 8Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 9Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 10Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 11Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 12Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 13Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 14Page - List of Unclassifed Manufacturers RT9237 Datasheet HTML 15Page - List of Unclassifed Manufacturers  
Zoom Inzoom in Zoom Outzoom out
 12 / 15 page
background image
RT9237
Preliminary
www.richtek-ic.com.tw
DS9237-00 January 2002
12
Layout Guide
Layout Guide
Place the high-power switching components first, and
separate them from sensitive nodes.
1. Most critical path: the current sense circuit is
the most sensitive part of the converter. The
current sense resistors tied to ISP1,2,3,4 and
ISN1,2,3,4 should be located not more than 0.5
inch from the IC and away from the noise
switching nodes. The PCB trace of sense
nodes should be parallel and as short as
possible. Kelvin connection of the sense
component
(additional
sense
resistor
or
MOSFET RDS(ON)) ensures the accurate stable
current sensing.
No Kelvin sense, no guarantee
for stable operation!
2. Switching ripple current path:
a. Input capacitor to high side MOSFET
b. Low side MOSFET to output capacitor
c. The return path of input and output capacitor
d. Separate the power and signal GND
e. The switching nodes(the connection node of
high/low side MOSFET and inductor) is the
most noisy points. Keep them away from
sensitive small-signal node.
f. Reduce parasitic R, L by minimum length,
enough copper thickness and avoiding of via.
3. MOSFET driver should be close to MOSFET
4. The compensation, bypass and other function
setting components should be near the IC and
away from the noisy power path.
Fig.7 Power Stage Ripple Current Path
V
SW1
L1
SW2
L2
RIN
VIN
CIN
VOUT
COUT
RL



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com