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SY89321L Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY89321L Datasheet(HTML) 3 Page - Micrel Semiconductor |
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3 / 5 page ![]() 3 Precision Edge™ SY89321L Micrel Absolute Maximum Ratings(Note 1) Supply Voltage (V CC) .................................. –0.5V to +3.8V Input Voltage (V IN) ......................................... –0.5V to VCC LVTT Output Current (I OUT) Continuous ............................................................. 50mA Surge .................................................................... 100mA Current (V BB) Source or sink current on V BB, Note 3 ................ ±1.5mA Lead Temperature (soldering, 10 sec.) ................... +220 °C Storage Temperature (T S) ....................... –65°C to +150°C Operating Ratings(Note 2) Supply Voltage (V CC) ...................................... 3.0V to 3.6V Ambient Temperature (T A) ......................... –40°C to +85°C Package Thermal Resistance, Note 4 MLF™ ( θ JA) Still-Air ................................................................. 93 °C/W 500lfpm ............................................................... 87 °C/W MLF™ ( Ψ JB) Junction-to-Board ................................................ 60 °C/W V CC = +3.3V ±10% Symbol Parameter Condition Min Typ Max Units I OS Output Short Circuit Current V OUT = 0V, Note 5 –80 —–275 mA I CC Power Supply Current — 14 20 mA V OH Output HIGH Voltage I OH = –3.0mA 2.0 —— V V OL Output LOW Voltage I OL = 24mA —— 0.5 V LVTTL DC ELECTRICAL CHARACTERISTICS V CC = +3.3V ±10%; TA = –40°C to +85°C unless otherwise noted. Symbol Parameter Condition Min Typ Max Units V IH Input HIGH Voltage V CC–1.165 — V CC–0.880 V V IL Input LOW Voltage V CC–1.810 — V CC–1.475 V V BB Bias Voltage V CC–1.38 V CC–1.32 V CC–1.26 V I IH Input HIGH Current —— 150 µA I IL Input LOW Current IN 0.5 —— µA Input LOW Current /IN –300 —— µA LVPECL DC ELECTRICAL CHARACTERISTICS Note 1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. Note 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Note 3. Due to the limited drive capability use for input of the same package only. Note 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential (GND) on the PCB. Note 5. Max. limit only applicable for short durations, not for continuous operation! |
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