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Page 4 of 4

Issue A

SO 8 = -5P

PLASTIC P

(ML12015-5P, ML12016-5P, ML12017-5P)

ACKAGE

CASE 751-06

(SO–8)

ISSUE T

OUTLINE DIMENSIONS

SEATING

PLANE

1

4

5

8

A

h

C

θ

X 45°

L

DIM

MIN

MAX

MILLIMETERS

A

1.35

1.75

A1

0.10

0.25

B

0.35

0.49

C

0.19

0.25

D

4.80

5.00

E

1.27 BSC

e

3.80

4.00

H

5.80

6.20

h

L

0.40

1.25

0.25

0.50

NOTES:

1. DIMENSIONING AND T OLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOW ABLE DAMBAR

PROTRUSION SHALL BE 0.127 T OTAL IN EXCESS

OF THE B DIMENSION A T MAXIMUM MATERIAL

CONDITION.

D

E

H

A

B

e

B

A1

C

A

0.10

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.

P DIP 8 = PP

PLASTIC PACKAGE

(ML12015PP, ML12016PP, ML12017PP)

CASE 626-04

LANSDALE Semiconductor, Inc.

ML12015, ML12016, ML12017