FAN53713

www.onsemi.com

2

Table 1. ORDERING INFORMATION

Part Number

Output Voltage

(Note 1)

Max. Output

Current

(Note 1)

Temperature

Range

Package

Packing

Method

Device

Marking

FAN53713UC02X

0.7 V

1.5 A

−40 to 85

°C

WLCSP

Tape & Reel

GJ

1. Other voltage and output current options are available. Contact an On Semiconductor representative.

Table 2. RECOMMENDED EXTERNAL COMPONENTS

Component

Description

Vendor

Parameter

Typ.

Unit

L

1.0

mH, 20%, 2.3 A, 107 mW, 1608

DFE160810S−1R0M (Murata)

L

1.0

mH

2.2

mF, 20%, 6.3 V, X5R, 0402

C1005X5R0J225M050BC (TDK)

C

2.2

mF

22

mF, 20%, 6.3 V, X5R, 0603

C1608X5R0J226M080AC (TDK)

C

22

1. A 10

mF, 0402 capacitor can be used to reduce total solution size at the expense of load transient performance.

Pin Configuration

Figure 2. Top View

C1

B1

A1

C2

B2

A2

EN

MODE

FB

VIN

SW

GND

C1

B1

A1

C2

B2

A2

VIN

SW

GND

EN

MODE

FB

Figure 3. Bottom View

Table 3. PIN DEFINITIONS

Pin #

Name

Description

A1

EN

Enable. The device is in Shutdown Mode when voltage to this pin is <0.4 V and enabled

when >1.2 V. Do not leave this pin floating. Recommended for GPIO 1.8 V to drive this pin

A2

VIN

B1

MODE

MODE

. Logic “LOW” allows the IC to be in a Super Low IQ (SLIQ) state. A Logic HIGH

allows the part to be in normal Iq state Auto Mode

B2

SW

Switching Node

. Connect to SW pad of inductor

C1

FB

Feedback. Connect to positive side of output capacitor

C2

GND

Ground. Power and IC ground. All signals are referenced to this pin

Table 4. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Min.

Max.

Unit

Input Voltage

−0.3

6.5

V

Voltage on SW Pin

−0.3

V

EN, FB and Mode Pin Voltage

−0.3

V

ESD

Human Body Model per JESD22−A114

2.0

kV

Charged Device Model per JESD22−C101

1.0

Junction Temperature

−

40

+150

°C

Storage Temperature

−

40

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.