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MB39C326 Datasheet(PDF) 13 Page - Cypress Semiconductor |
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MB39C326 Datasheet(HTML) 13 Page - Cypress Semiconductor |
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13 / 22 page ![]() Document Number: 002-08348 Rev. *B Page 13 of 22 MB39C326 14. Notes on Board Layout A suitable board layout is required for stable operations of this IC. Place the peripheral component, input capacitance CIN and the output capacitance COUT close to this IC as much as possible, and connect them with the shortest routes. The routes with large current, in particular, the routes with variable current must be placed on the front surface with the shortest routes. Separate DGND from GND and connect GND at one point close to COUT. Provide the ground plane as much as possible on the IC mounted face. It is useful for heat dissipation. VDD L C C C C C R R R VCC FB Vout DGND |
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