30 MICS/SMD

01/2018

3

*a

coplanarity max. 0.1 mm

*b

press-fit spigot

*c

contact with retaining hook (12–16 pole one, 18–26 pole two)

*d

SMT solder area, contact bearing surface 0.3 x 1.2 mm

*e

contact 1

*f

printed circuit board layout, components side view

*g

necessary space for use of pull-off tongs AZ30

*h

component area (B x 7)

*i

recommended thickness of circuit board 1.5 ±0.14 mm

*k

bore hole for contact with retaining hook

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