Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

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Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.

10

Cree PLCC6 3 in 1 SMD LED

CLV6B-FKB

REFLOW SOLDERING

•

TheCLV6B-FKBisratedasaMSL5aproduct.

•

Therecommendedfloorlifeoutofbagis24hrs.

•

•

Thetemperatureprofileisasbelow:

Use only with CLV6B-FKB

Solderingpad:

Solder

Average ramp-up rate = 4ºC/s max

Preheat temperature = 150ºC ~200ºC

Preheat time = 120s max

Ramp-down rate = 6ºC/s max

Peak temperature = 250ºC max

Time within 5ºC of actual Peak Temperature = 10s max

Duration above 217ºC is 45s max

Document No.: COTCO-05-0057

Rev. NO.:

13

6/9

Melting-point

Pre-heat

Soak

Reflow

Cooling

Time

Use all SMD besides LP6-NPP1-01-N1

Solder = Sn63-Pb37

Solder = Lead-free

Average ramp-up rate =4ºC/s max.

Average ramp-up rate =4ºC/s max

Preheattemperature = 100ºC ~150ºC

Preheattemperature = 150ºC ~200ºC

Preheattime = 100s max.

Preheattime = 100s max.

Ramp-down rate =6ºC/s max.

Ramp-down rate =6ºC/s max.

Peaktemperature = 230ºC max.

Peaktemperature = 250ºC max.

Time within5ºC of actual Peak Temperature = 10s max.

Time within5ºC of actual Peak Temperature = 10s max.

Duration above 183ºC is 80s max.

Duration above 217ºC is 80s max.

Only use LP6-NPP1-01-N1

[13]

Solder = Low Lead-free

Average ramp-up rate =3ºC/s max.

Preheattemperature = 130ºC ~170ºC

Preheattime = 120s max.

Ramp-down rate =6ºC/s max.

Peaktemperature = 213ºC max.

Time within3ºC of actual Peak Temperature = 25s max.

Duration above 200ºC is 40s max.

Recommended solder pad designfor heat dissipation (2-pin SMD LED):

7.0

2.6



Recommended solder pad designfor heat dissipation (4-pin SMD LED)

8.2

2.7