74AHCT2G08DP datasheet(2/17 Pages) PHILIPS

2 / 17 page

9397 750 13735

Product data sheet

Rev. 02 — 18 October 2004

2 of 17

Philips Semiconductors

74AHC2G08; 74AHCT2G08

Dual 2-input AND gate

[1]

CPD is used to determine the dynamic power dissipation (PD in µW).

PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:

fi = input frequency in MHz;

fo = output frequency in MHz;

CL = output load capacitance in pF;

VCC = supply voltage in Volts;

N = number of inputs switching;

Σ(CL × VCC2 × fo) = sum of the outputs.

[2]

The condition is Vi = GND to VCC.

Ordering information

Marking

Type 74AHCT2G08

tPHL, tPLH

propagation delay

A and B to Y

CL = 15 pF; VCC = 5 V

3.6

6.2

input capacitance

1.5

CPD

power dissipation

capacitance

CL = 50 pF; fi = 1 MHz

[1] [2] -19

Table 1:

Quick reference data …continued

GND = 0 V; Tamb =25 °C; tr =tf ≤ 3.0 ns.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 2:

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74AHC2G08DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74AHCT2G08DP

−40 °C to +125 °C

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74AHC2G08DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package;

8 leads; body width 2.3 mm

SOT765-1

74AHCT2G08DC

−40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package;

8 leads; body width 2.3 mm

SOT765-1

74AHC2G08GM

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package;

no leads; 8 terminals; body 0.95

× 1.95 × 0.5 mm

SOT833-1

74AHCT2G08GM

−40 °C to +125 °C

XSON8

plastic extremely thin small outline package;

no leads; 8 terminals; body 0.95

× 1.95 × 0.5 mm

SOT833-1

Table 3:

Marking

Type number

Marking code

74AHC2G08DP

A08

74AHCT2G08DP

C08

74AHC2G08DC

A08

74AHCT2G08DC

C08

74AHC2G08GM

A08

74AHCT2G08GM

C08

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