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BGA2011 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BGA2011
Description  900 MHz high linear low noise amplifier
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BGA2011 Datasheet(HTML) 2 Page - NXP Semiconductors

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2000 Dec 04
2
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
BGA2011
FEATURES
• Low current, low voltage
• High linearity
• High power gain
• Low noise
• Integrated temperature compensated biasing
• Control pin for adjustment bias current.
APPLICATIONS
• RF front end
• Low noise amplifiers, e.g. CDMA, PHs, Dect, etc.
DESCRIPTION
Silicon Monolitic Microwave Integrated Circuit (MMIC)
amplifier consisting of an NPN double polysilicon transistor
with integrated biasing for low voltage applications in a
6-pin SOT363 plastic SMD package.
PINNING
PIN
DESCRIPTION
1
RF in
2VC
3VS
4
RF out
5, 6
GND
handbook, halfpage
Top view
MBL251
BIAS
CIRCUIT
RF in
RF out
GND
VS
VC
13
2
4
5
6
Fig.1 Simplified outline (SOT363) and symbol.
Marking code:A5-
QUICK REFERENCE DATA
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
VS
DC supply voltage
RF input AC coupled
3
4.5
V
IS
DC supply current
15
−
mA
IC
DC control current
VC =VS
0.11
−
mA
|s21|2
insertion power gain
in application circuit, see Fig.2;
f = 900 MHz
19
−
dB
NF
noise figure
IS = 15 mA; f = 900 MHz
1.7
−
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VS
DC supply voltage
RF input AC coupled
−
4.5
V
VC
voltage on control pin
−
VS
V
IS
supply current
forced by DC voltage on RF input
−
30
mA
IC
control current
−
0.25
mA
Ptot
total power dissipation
Ts ≤ 100 °C
−
135
mW
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−
150
°C



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