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LAG6SP Datasheet(PDF) 12 Page - OSRAM GmbH |
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LAG6SP Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 21 page ![]() 2016-07-13 12 Version 1.4 LA G6SP - Dual Binning Recommended Solder Pad 8) page 20 Reflow soldering Empfohlenes Lötpaddesign 8) Seite 20 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation C A A 2 0.8 (0.031) OHLPY925 0.35 (0.014) 0.8 (0.031) Package marking |
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