LAM67B datasheet(11/21 Pages) OSRAM

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LAM67B Datasheet(PDF) 11 Page - OSRAM GmbH

11 / 21 page

LA M67B

11 Version 1.2 | 2018-04-16

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.

Recommended Solder Pad 9)

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

0.8 (0.031)

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