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LAW5SM Datasheet(PDF) 12 Page - OSRAM GmbH |
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LAW5SM Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  LA W5SM 12 Version 1.2 | 2018-02-13 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 8) Solder resist Freies Kupfer Bare Copper Lötpasten Schablone Solder paste stencil Lötstopplack OHAY0681 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) |
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