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LM4856LQ Datasheet(PDF) 16 Page - National Semiconductor (TI) |
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LM4856LQ Datasheet(HTML) 16 Page - National Semiconductor (TI) |
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16 / 23 page  Application Information (Continued) TABLE 3. Volume Control V4 V3 V2 V1 V0 Gain (dB) G2 G1 R IN,LIN to R OUT,LOUT P HS to R OUT,LOUT 00000 -34.5 -40.5 00001 -33.0 -39.0 00010 -31.5 -37.5 00011 -30.0 -36.0 00100 -28.5 -34.5 00101 -27.0 -33.0 00110 -25.5 -31.5 00111 -24.0 -30.0 01000 -22.5 -28.5 01001 -21.0 -27.0 01010 -19.5 -25.5 01011 -18.0 -24.0 01100 -16.5 -22.5 01101 -15.0 -21.0 01110 -13.5 -19.5 01111 -12.0 -18.0 10000 -10.5 -16.5 10001 -9.0 -15.0 10010 -7.5 -13.5 10011 -6.0 -12.0 10100 -4.5 -10.5 10101 -3.0 -9.0 10110 -1.5 -7.5 10111 0.0 -6.0 11000 1.5 -4.5 11001 3.0 -3.0 11010 4.5 -1.5 11011 6.0 0.0 11100 7.5 1.5 11101 9.0 3.0 11110 10.5 4.5 11111 12.0 6.0 EXPOSED-DAP MOUNTING CONSIDERATIONS The LM4856’s exposed-DAP (die attach paddle) package (LD) provides a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper area heatsink, copper traces, ground plane, and finally, surrounding air. The result is a low voltage audio power amplifier that produces 1.1W dissipation in a 8 Ω load at ≤ 1% THD+N. This high power is achieved through careful consideration of necessary thermal design. Failing to opti- mize thermal design may compromise the LM4856’s high power performance and activate unwanted, though neces- sary, thermal shutdown protection. The LD package must have its DAP soldered to a copper pad on the PCB. The DAP’s PCB copper pad is then, ideally, connected to a large plane of continuous unbroken copper. This plane forms a thermal mass, heat sink, and radiation area. Place the heat sink area on either outside plane in the case of a two-sided or multi-layer PCB. (The heat sink area can also be placed on an inner layer of a multi-layer board. The thermal resistance, however, will be higher.) Connect the DAP copper pad to the inner layer or backside copper heat sink area with 6 (3 X 2) (LD) vias. The via diameter should be 0.012in - 0.013in with a 1.27mm pitch. Ensure efficient thermal conductivity by plugging and tenting the vias with plating and solder mask, respectively. Best thermal performance is achieved with the largest prac- tical copper heat sink area. If the heatsink and amplifier share the same PCB layer, a nominal 2.5in 2 (min) area is necessary for 5V operation with a 4 Ω load. Heatsink areas www.national.com 16 |
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