SP1233 datasheet(4/5 Pages) LITTELFUSE

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Specifications are subject to change without notice.

TVS Diode Arrays (SPA®Diodes)

Revision: 01/30/18

TVS Diode Arrays (SPA® Diodes)

General Purpose ESD Protection - SP1103C Series

Part Numbering System

Part Marking System

1233 01

T G

Series

Number of

Channels

Package

T= Tape & Reel

G= Green

–

SOD882

TVS Diode Arrays

(SPA®Diodes)

Date code

Part code

Ordering Information

Part Number

Package

Marking

Min. Order Qty.

SP1233-01ETG

SOD882

10,000

Time

TS(max)

TS(min)

time to peak temperature

Preheat

Ramp-up

Ramp-down

Ramp-do

Critical Zone

TL to TP

Critical Zone

TL to TP

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min))

150°C

- Temperature Max (T

s(max))

200°C

- Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp (T

to peak

3°C/second max

S(max) to TL - Ramp-up Rate

3°C/second max

Reflow

- Temperature (T

L) (Liquidus)

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

260+0/-5 °C

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

SP1233

Product Characteristics

Lead Plating

Pre-Plated Frame

Lead Material

Copper Alloy

Substrate material

Silicon

Body Material

Molded Compound

Flammability

UL Recognized compound meeting

flammability rating V-0.

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

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