Low Capacitance ESD Protection - SP3022 Series

Package Dimensions — 0201 Flipchip

Symbol

0201 Flipchip

Millimeters

Inches

Min

Typ

Max

Min

Typ

Max

A

0.595

0.620

0.645

0.0234 0.0244 0.0254

B

0.295

0.320

0.345

0.0116

0.0126

0.0136

C

0.245

0.275

0.305

0.0096

0.0108

0.0120

D

0.145

0.150

0.155

0.0057 0.0059 0.0061

E

0.245

0.250

0.255

0.0096 0.0098

0.0100

F

0.245

0.250

0.255

0.0096 0.0098

0.0100

G

0.005

0.010

0.015

0.0002 0.0004 0.0006

A

B

D

E

D

F

C

G

0.28

0.30

0.75

0.19

Recommended Solder Pad Footprint

*Sizes in mm

Recommended Soldering Pad Layout

0.650

0.325

0.325

0.975

0.650

0.650

Package Dimensions — SOD882

Symbol

Package

SOD882

JEDEC

MO-236

Millimeters

Inches

Min

Typ

Max

Min

Typ

Max

A

0.95

1.00

1.05

0.037

0.039

0.041

B

0.55

0.60

0.65

0.022

0.024

0.026

C

0.50

0.55

0.60

0.020

0.022

0.024

D

0.45

0.018

E

0.20

0.25

0.30

0.008

0.010

0.012

F

0.45

0.50

0.55

0.018

0.020

0.022

Part Numbering System

Series

Number of

Channels

Package

T= Tape & Reel

G= Green

–

TVS Diode Arrays

W: 0201 Flipchip

E: SOD882

Part Marking System

SP3022-01WTG

SP3022-01ETG

Part Number

Package

Marking

Min. Order Qty.

Packaging Option

P0/P1

Packaging Specification

SP3022-01WTG

0201 Flipchip

-

10000

Tape & Reel – 8mm tape/7” reel

4mm/2mm

EIA RS-481

SP3022-01ETG

SOD882

-

10000

Tape & Reel – 8mm tape/7” reel

4mm/2mm

EIA RS-481

Ordering Information

© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 11/13/17