©2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revision: 12/07/16

Low Capacitance ESD Protection - SP3145 Series

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp (T

to peak

3°C/second max

T

3°C/second max

Reflow

- Temperature (T

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Ordering Information

Part Number

Package

Min. Order Qty.

SP3145-01WTG

01005 Flipchip

15000

Part Numbering System

Part Marking System

SP 3145 01

T G

Series

Number of

Channels

Package

T= Tape & Reel

G= Green

–

W: 01005 Flipchip

TVS Diode Arrays

W

Package Dimensions — 01005 Flipchip

Symbol

01005 Flipchip

Millimeters

Inches

Min

Typ

Max

Min

Typ

Max

A

0.168

0.181

0.194

0.007

0.007

0.008

A1

0.008

0.011

0.014

0.000

0.000

0.001

A2

0.160

0.170

0.180

0.006

0.007

0.007

e

0.280 BSC

0.011 BSC

D

0.200

0.230

0.260

0.008

0.009

0.010

E

0.400

0.430

0.460

0.016

0.017

0.018

F

0.110

0.130

0.150

0.004

0.005

0.006

G

0.180

0.200

0.220

0.007

0.008

0.009

P

0.130

0.150

0.170

0.005

0.006

0.007

F

e

P

Bottom View

Side View

E

Top View

Pin 1

0.15mm

0.30mm

0.15mm

0.30mm

0.15mm

Recommended soldering pad layout

Stencil apertures