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LVW5SN Datasheet(PDF) 13 Page - OSRAM GmbH |
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LVW5SN Datasheet(HTML) 13 Page - OSRAM GmbH |
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13 / 18 page  LV W5SN 2010-09-08 13 Empfohlenes Lötpaddesign 7) Seite 18 Reflow Löten Recommended Solder Pad 7) page 18 Reflow Soldering Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected Solder resist Bare Copper Freies Kupfer Lötpasten Schablone Solder paste stencil Lötstopplack OHPY3637 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) 1 (0.039) |
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