| Electronic Components Datasheet Search |
|
MP2326GD Datasheet(PDF) 19 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP2326GD Datasheet(HTML) 19 Page - Monolithic Power Systems |
|
19 / 25 page ![]() MP2326 – 19V, 4A, LOW IQ STEP-DOWN CONVERTER MP2326 Rev. 1.1 www.MonolithicPower.com 19 1/28/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. OUT OUT OUT ESR SW IN VV V(1 ) R FL V (22) In addition to considering the output ripple, choosing a larger output capacitor can achieve improved load transient response. However, the maximum output capacitor limitation should be considered in design application. If the output capacitor value is too high, the output voltage cannot reach the design value during the soft- start time, causing it to fail to regulate. The maximum output capacitor value Co_max can be limited approximately by: O_ MAX LIM _ AVG OUT ss OUT C(I I ) T / V (23) Where, ILIM_AVG is the average start-up current during the soft-start period. Tss is the soft-start time. External Bootstrap Diode BST voltage may become insufficient during particular conditions. In these cases, an external bootstrap diode can enhance the efficiency of the regulator and help to avoid insufficient BST voltage during light-load PFM operation. The insufficient BST voltage is more likely to happen at either of the following conditions: VIN is low The duty cycle is large: D= IN OUT V V >65% In these cases (if insufficient BST voltage occurs), the output-ripple voltage may become extremely large during a light-load condition, or there may be poor efficiency during a heavy- load condition. Add an external BST diode from VCC to BST as shown in Fig. 12. FIGURE 12. Optional External Bootstrap Diode The recommended external BST diode is IN4148. PCB Layout Guidelines Efficient PCB layout is critical for efficient operation. A poor layout design can result in poor line or load regulation and stability issues. For best results, please refer to Fig.13 and follow the guidelines below: 1)Place the high-current paths (GND, IN, and SW) very close to the device with short, direct, and wide traces. 2)Place the input capacitor as close as possible to IN and GND. 3)Place the FREQ/MODE circuit very close to the part. 4)Place the external feedback resistors next to FB. 5)Keep the switching node SW short and away from the feedback network. For optimum performance, use 4-layer boards. Fig. 13 shows the top and bottom layers of the PCB (Inner 1 and Inner 2 are all GND). sw VOUT GND VIN R1 R2 GND C1A C1B C2A C2B R5 R7 R6 C3 C4 Rb Cb R3 L C1 Top Layer MP2326 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |