Rev. 1.5

Page 2 of 17

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Table 2. Pin Description

Pin

Symbol

Functionality

1

OE/NC

Output Enable

H

L: output is high impedance. Only output driver is disabled.

No Connect

Any voltage between 0 and Vdd or Open

cy output. Pin 1 has no function.

2

GND

Power

Electrical ground

[2]

3

OUT

Output

Oscillator output

4

VDD

Power

Power supply voltage

[2]

Notes:

1. In OE mode, a pull-up resistor of 10k

Ω or less is recommended if pin 1 is not externally driven. If pin 1

needs to be left floating, use the NC option.

2. A capacitor of value 0.1 µF or higher between Vdd and GND is required.

Top View

1

4

OE/NC

VDD

3

2

GND

OUT

Figure 1. Pin Assignments

Table 3. Absolute Maximum Limits

Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance

of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.

Parameter

Min.

Max.

Unit

Storage Temperature

-65

150

°C

Vdd

-0.5

4

V

Electrostatic Discharge

–

2000

V

Soldering Temperature (follow standard Pb free

soldering guidelines)

–

260

°C

Junction Temperature

[3]

–

150

°C

Note:

3. Exceeding this temperature for extended period of time may damage the device.

Table 4. Thermal Consideration

[4]

Package

(°C/W)

(°C/W)

(°C/W)

7050

142

273

30

5032

97

199

24

3225

109

212

27

2520

117

222

26

2016

152

252

36

Note:

4. Refer to JESD51 for

θJA and θJC definitions, and reference layout used to determine the θJA and θJC values in the above table.

Table 5. Maximum Operating JunctionTemperature

[5]

Max Operating Temperature (ambient)

Maximum Operating Junction Temperature

85°C

93°C

105°C

113°C

125°C

133°C

Note:

5. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.

Table 6. Environmental Compliance

Parameter

Condition/Test Method

Mechanical Shock

MIL-STD-883F, Method2002

Mechanical Vibration

MIL-STD-883F, Method2007

Temperature Cycle

JESD22, Method A104

Solderability

MIL-STD-883F, Method2003

Moisture Sensitivity Level

MSL1 @ 260°C