STD3PS25 datasheet(2/10 Pages) STMICROELECTRONICS

Part #	STD3PS25

Description	P-CHANNEL 250V - 2.1 OHM - 3A DPAK/IPAK MESH OVERLAY MOSFET

PDF	10 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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2 / 10 page

STD3PS25 - STD3PS25-1

2/10

THERMAL DATA

ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)

OFF

DYNAMIC

Rthj-case

Thermal Resistance Junction-case Max

2.77

°C/W

Rthj-amb

Thermal Resistance Junction-ambient Max

100

°C/W

Maximum Lead Temperature For Soldering Purpose

275

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

V(BR)DSS

Drain-source

Breakdown Voltage

ID = 250 µA, VGS = 0

250

IDSS

Zero Gate Voltage

Drain Current (VGS =0)

VDS = Max Rating

1µA

VDS = Max Rating, TC = 125 °C

µA

IGSS

Gate-body Leakage

Current (VDS =0)

VGS = ± 20 V

±10

µA

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VGS(th)

Gate Threshold Voltage

VDS =VGS,ID = 250 µA

234

RDS(on)

Static Drain-source On

Resistance

VGS =10 V,ID = 0.3 A

2.1

2.8

Ω

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Ciss

Input Capacitance

VDS =25V,f= 1MHz, VGS =0

260

Coss

Output Capacitance

Crss

Reverse Transfer

Capacitance

Gate-Input Resistance

f = 1 MHz,Gate DC Bias=0

Test Signal Level=20 mV

Open Drain

Ω

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