| Electronic Components Datasheet Search |
|
MPM3680 Datasheet(PDF) 4 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MPM3680 Datasheet(HTML) 4 Page - Monolithic Power Systems |
|
4 / 19 page ![]() MPM3680 – 18V 6A STEP-DOWN POWER MODULE MPM3680 Rev. 1.02 www.MonolithicPower.com 4 10/13/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN to GND .............-0.3V to 21V VSW(DC) to GND .......................... –1V to VIN+0.3V VSW5 (30ns) to GND............. –3 V to VIN+3V or 24V VBST .......................................... –0.3 V to VIN+6V All Other Pins to AGND..................–0.3V to +6V Continuous Power Dissipation (TA=+25) (2) QFN-65 (12mmx12mmx4mm)...................... 50W Continuous Output Current........................... 8A Junction Temperature...............................150 C Lead Temperature ....................................260 C Storage Temperature.............. –55 C to +150C MSL ................................................... Level 3 (5) ESD (HBM) ................................................. 2kV ESD (CDM)............................................... 500V Recommended Operating Conditions (3) Supply Voltage VIN........................... 4.5V to 18V Output Voltage VOUT ........................ 0.65V to 5V Enable Current IEN……………………..…....1mA Ambient Temperature................–40 C to +85C Junction Temperature..............–40 C to +125C Thermal Resistance (4) θJA θJC QFN-57 (12mmx12mmx4mm)..16.2 .... 6.3 .. C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. 5) Need to get some test data from 1st sample for calibration and evaluation for MSL Level 2. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |