MP8005DF datasheet(2/11 Pages) MPS

2 / 11 page

MP8005 – IEEE 802.3af PoE POWERED DEVICE CONTROLLER

MP8005 Rev. 1.0

www.MonolithicPower.com

9/26/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP8005DF

TSSOP-20-EP

MP8005DF

–40

°C to +85°C

For Tape & Reel, add suffix –Z (e.g. MP8005DF–Z).

For Lead Free, add suffix –LF (e.g. MP8005DF–LF–Z)

PACKAGE REFERENCE

AGND

ISENSE

RDELAY

VFB

VDD

RTN

COMP

VCC

MAINGATE

SYNCGATE

CSS

ENABLE

ILIM

CLASS

DET

VSS

ABSOLUTE MAXIMUM RATINGS (1)

VDD, RTN....................................–0.3V to +100V

PG, DET ......................................–0.3V to +57V

VCC, CLASS .................................–0.3V to +10V

ILIM, CSS, ENABLE. .......................–0.3V to +5V

ISENSE. ...........................................–0.3V to +28V

COMP. ...........................................–0.3V to +3V

FB . .............................................–0.3V to +1.3V

Continuous Power Dissipation

(TA = +25°C)

(2)

. ............................................................ 1.2W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65°C to +150

°C

Recommended Operating Conditions

(3)

Supply Voltage VDD .............................0V to 57V

Output Current IOUT .............................. 0 to 0.4A

Junction Temperature TJ......... –40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

TSSOP-20-EP........................105 ..... 50 ...

°C/W

Notes:

1) Exceeding “Absolute Maximum Ratings” may cause

permanent damage to the device. Functional operation at or

above these conditions is not implied

Exposure to these conditions for extended periods may

affect device reliability.

2) The maximum allowable power dissipation is a function of

the maximum junction temperature. TJ(MAX) the junction-to-

ambient

thermal

resistance.

θJA and the ambient

temperature, TA the maximum allowable power dissipation at

any

ambient

temperature

calculated

using:

PD(MAX)=(TJ(MAX)-TA)/ θJA. Exceeding the maximum

allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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