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LTM4622A Datasheet(PDF) 4 Page - Linear Technology |
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LTM4622A Datasheet(HTML) 4 Page - Linear Technology |
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4 / 30 page ![]() LTM4622A 4 Rev B For more information www.analog.com ELECTRICAL CHARACTERISTICS Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM4622A is tested under pulsed load conditions such that TJ ≈ TA. The LTM4622AE is guaranteed to meet performance specifications over the 0°C to 125°C internal operating temperature range. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4622AI is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VINTVCC Load Reg INTVCC Load Regulation ICC = 0mA to 50mA 1.3 % fOSC Oscillator Frequency 1 MHz fSYNC Frequency Sync Range With Respect to Set Frequency ±30 % IMODE MODE Input Current MODE = INTVCC –1.5 µA Note 3: See output current derating curves for different VIN, VOUT and TA. Note 4: 100% tested at wafer level. Note 5: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. The l denotes the specifications which apply over the specified internal operating temperature range (Note 2). Specified as each individual output channel at TA = 25°C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in Figure 27. |
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