LTM4607 datasheet(18/26 Pages) LINER

18 / 26 page

LTM8055

8055fb

For more information www.linear.com/LTM8055

APPLICATIONS INFORMATION

of them can be individually used to accurately predict the

thermal performance of the product. Likewise, it would

be inappropriate to attempt to use any one coefficient to

correlate to the junction temperature versus load graphs

givenintheproduct’sdatasheet.Theonlyappropriateway

to use the coefficients is when running a detailed thermal

analysis, such as FEA, which considers all of the thermal

resistances simultaneously.

A graphical representation of these thermal resistances

is given in Figure 7.

The blue resistances are contained within the µModule

converter, and the green are outside.

The die temperature of the LTM8055 must be lower than

the maximum rating of 125°C, so care should be taken in

the layout of the circuit to ensure good heat sinking of the

LTM8055. The bulk of the heat flow out of the LTM8055

is through the bottom of the μModule converter and the

BGA pads into the printed circuit board. Consequently a

poor printed circuit board design can cause excessive

heating, resulting in impaired performance or reliability.

Please refer to the PCB Layout section for printed circuit

board design suggestions.

Figure 7

8055 F07

µMODULE CONVERTER

JUNCTION-TO-CASE (TOP)

RESISTANCE

JUNCTION-TO-BOARD RESISTANCE

JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)

CASE (TOP)-TO-AMBIENT

RESISTANCE

BOARD-TO-AMBIENT

RESISTANCE

JUNCTION-TO-CASE

(BOTTOM) RESISTANCE

JUNCTION

AMBIENT

CASE (BOTTOM)-TO-BOARD

RESISTANCE

LTM4607 Datasheet(PDF) 18 Page - Linear Technology

LTM4607 Datasheet(HTML) 18 Page - Linear Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Datasheet Download

Link URL