LT8603

37

8603f

For more information www.linear.com/LT8603

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LT8603#packaging for the most recent package drawings.

6.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 TOP MARK

(SEE NOTE 6)

PIN 1 NOTCH

R = 0.45 OR

0.35

× 45°

CHAMFER

0.40 ±0.10

40

39

1

2

BOTTOM VIEW—EXPOSED PAD

4.50 REF

(4-SIDES)

4.42 ±0.10

4.42 ±0.10

4.42 ±0.05

4.42 ±0.05

0.75 ±0.05

R = 0.115

TYP

0.25 ±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UJ40) QFN REV Ø 0406

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

4.50 ±0.05

(4 SIDES)

5.10 ±0.05

6.50 ±0.05

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

R = 0.10

TYP

UJ Package

40-Lead Plastic QFN (6mm

× 6mm)

(Reference LTC DWG # 05-08-1728 Rev Ø)

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.