LT3694 datasheet(32/34 Pages) LINER

32 / 34 page

LT3667

3667fb

For more information www.linear.com/LT3667

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

3.00 ± 0.10

1.50 REF

5.00 ± 0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

3.50 REF

0.75 ± 0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.20 OR 0.25

× 45° CHAMFER

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UDD24) QFN 0808 REV Ø

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

3.50 REF

4.10 ± 0.05

5.50 ± 0.05

1.50 REF

2.10 ± 0.05

3.50 ± 0.05

PACKAGE OUTLINE

R = 0.05 TYP

1.65 ± 0.10

3.65 ± 0.10

1.65 ± 0.05

UDD Package

24-Lead Plastic QFN (3mm

× 5mm)

(Reference LTC DWG # 05-08-1833 Rev Ø)

3.65 ± 0.05

0.50 BSC

LT3694 Datasheet(PDF) 32 Page - Linear Technology

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