Data Sheet

HMC753

Rev. E | Page 13 of 13

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

BOTTOM VIEW

TOP VIEW

SIDE VIEW

4.10

4.00 SQ

3.90

0.95

0.85

0.75

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.31

0.25

0.19

0.20 MIN

2.85

2.70 SQ

2.55

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 24. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(HCP-24-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

MSL Rating

Package Description

Package Option

HMC753LP4E

−40°C to +85°C

MSL1

24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

HCP-24-3

HMC753LP4ETR

−40°C to +85°C

MSL1

24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

HCP-24-3

122826-HMC753LP4E

Evaluation Board

1

All models are RoHS Compliant Parts.

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registered trademarks are the property of their respective owners.

D13494-0-11/17(E)