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LO-T670 Datasheet(PDF) 11 Page - OSRAM GmbH |
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LO-T670 Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 19 page  Version 1.0 (Replacement in due course) LO T670 2013-06-28 11 Recommended Solder Pad 9) page 18 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 18 Reflow-Löten Recommended Solder Pad 9) page 18 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 18 Reflow-Löten Reflow Soldering / Reflow Löten OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
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