BAT54T/AT/CT/ST

Document number: DS30259 Rev. 16 - 2

4 of 5

www.diodes.com

May 2018

© Diodes Incorporated

BAT54T/AT/CT/ST

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT523

E1

E

b

e1

D

A3

e

A2

A1

L

c

a

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT523

Y1

X

Y

X1

C

Note:

The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These dimensions

may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by

adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns,

and for International grid details, please see document IEC, Publication 97.

Note:

For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between

device Terminals and PCB tracking.

SOT523

Dim

Min

Max

Typ

A1

0.00

0.10

0.05

A2

0.60



0.80

0.75

A3

0.45

0.65

0.50

b

0.15

0.30

0.22

c

0.10

0.20

0.12

D

1.50

1.70

1.60

E

1.45

1.75

1.60

E1

0.75

0.85

0.80

e

0.50 BSC

e1

0.90

1.10

1.00

L

0.20

0.40

0.33

a

0

°

--

8

°

All Dimensions in mm

Dimensions

Value

(in mm)

C

1.29

X

0.40

X1

0.70

Y

0.51

Y1

1.80