ISL58113

FN7659 Rev 1.00

Page 2 of 9

July 29, 2013

Pin Configuration

ISL58113

(24 LD QFN)

TOP VIEW

19

18

17

16

15

14

13

1

2

3

4

5

6

7

THERMAL

NC

DATA

DATAB

GND

DIS

NC

NC

NC

GND

VCC

IOUT

VCC

VCC

PDIN

THERMAL

PAD

Pin Descriptions

PIN

NAME

PIN

NUMBER

I/O

TYPE

DESCRIPTION

DATA

2

I

LVDS

Input data to control Laser Switching Control

DATAB

3

I

LVDS

Input data to control Laser Switching Control

GND

4, 18, 24

Ground

Ground

DIS

5

I

Digital

Disable output current

NC

1, 6, 7, 19,

23

I

No connect

No connect

CHPEN

8

I

Digital

Chip Enable; Pull High to Enable

RPS

9

I

Analog

External resistor sets the Hsync detection power

RBIAS

10

Analog

Resistors set bias threshold current. See “Applications Information” on page 7 for more details

RSET

11

O

Analog

Bandgap derived internal reference

IVOUT

12

O

Analog

Calibrate channel with an external trimpot to GND

Adjust the IV amplifier gain

PDIN

13

I

Analog

Photo Diode input to the IV amplifier

VCC

14, 15, 17

Power

Supply Voltage

IOUT

16

O

Analog

Laser Current Output

HPSB

20

I

TLL

Hsync Power Select Enable; Active Low. During HPSB is low AND Hsync signal from photo

detector is low, the output current is set by RPS

CALB

21

I

TTL

Samples the laser power for APC; Active Low

VC

22

I

Analog

Voltage Controlling Laser Switching Current; 0V to 2V input for 0% to 100% output

Thermal

Pad

-

Exposed Thermal Pad should be soldered to GND

NOTE: Pins with the same name are not necessary internally connected together. LDD pins must not be used for connecting together external

components or features.