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UPD63335 Datasheet(PDF) 2 Page - NEC

Part # UPD63335
Description  MOS INTEGRATED CIRCUITS
PDF  13 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPD63335 Datasheet(HTML) 2 Page - NEC

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Philips Semiconductors
PHP/PHB110NQ08LT
N-channel TrenchMOS™ logic level FET
Product data
Rev. 01 — 29 March 2004
2 of 13
9397 750 12924
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
3.
Ordering information
4.
Limiting values
Table 2:
Ordering information
Type number
Package
Name
Description
Version
PHP110NQ08LT
TO-220AB
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads
SOT78
PHB110NQ08LT
D2-PAK
Plastic single-ended surface mounted package; 3 leads (one lead cropped) SOT404
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
25
°C ≤ T
j ≤ 175 °C
-
75
V
VDGR
drain-gate voltage (DC)
25
°C ≤ Tj ≤ 175 °C; RGS =20kΩ
-75
V
VGS
gate-source voltage (DC)
-
±20
V
ID
drain current (DC)
Tmb =25 °C; VGS =10V; Figure 2 and 3
-75
A
Tmb = 100 °C; VGS =10V; Figure 2
-75
A
IDM
peak drain current
Tmb =25 °C; pulsed; tp ≤ 10 µs; Figure 3
-
240
A
Ptot
total power dissipation
Tmb =25 °C; Figure 1
-
230
W
Tstg
storage temperature
−55
175
°C
Tj
junction temperature
−55
175
°C
Source-drain diode
IS
source (diode forward) current (DC)
Tmb =25 °C
-
75
A
ISM
peak source (diode forward) current Tmb =25 °C; pulsed; tp ≤ 10 µs
-
240
A
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source
avalanche energy
unclamped inductive load; ID =75A;
tp = 0.15 ms; VDD ≤ 75 V; RGS =50 Ω;
VGS = 10 V; starting Tj =25 °C
-
560
mJ



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