7 / 8 page
4-589
RF3374
Rev A7 050310
Power Dissipation versus Device Voltage Across
Temperature (TAMBIENT = +85°C)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
4.10
4.15
4.20
4.25
4.30
4.35
4.40
VPIN (V)
Bias Current versus Supply Voltage Across Temperature
(At evaluation board connector, RBIAS = 22Ω)
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
5.0
5.2
5.4
5.6
5.8
6.0
6.2
6.4
6.6
6.8
7.0
VCC (V)
-40°C
+25°C
+85°C
Bias Current versus Devices Voltage Across
Temperature (At pin 3)
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
VPIN (V)
-40°C
+25°C
+85°C
Reverse Isolation versus Frequency Across
Temperature (ICC = 65 mA)
-30.0
-25.0
-20.0
-15.0
-10.0
-5.0
0.0
0.0
1000.0
2000.0
3000.0
4000.0
5000.0
6000.0
7000.0
Frequency (MHz)
-40°C
+25°C
+85°C
Junction Temperature versus Power Dissipated
(TAMBIENT = +85°C)
100.000
110.000
120.000
130.000
140.000
150.000
160.000
0.225
0.250
0.275
0.300
0.325
0.350
Power Dissipated (W)
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
