ICL7611, ICL7612

FN2919 Rev 9.00

Page 2 of 13

April 26, 2007

Ordering Information

PART NUMBER

PART MARKING

TEMP. RANGE (°C)

PACKAGE

PKG. DWG. #

ICL7611DCBA

7611 DCBA

0 to +70

8 Ld SOIC (150 mil)

M8.15

ICL7611DCBAZ (Note)

7611 DCBAZ

0 to +70

8 Ld SOIC (150 mil) (Pb-free)

M8.15

ICL7611DCBA-T

7611 DCBA

0 to +70

8 Ld SOIC (150 mil) Tape and Reel

M8.15

ICL7611DCBAZ-T (Note)

7611 DCBAZ

0 to +70

8 Ld SOIC (150 mil) Tape and Reel (Pb-free)

M8.15

ICL7611DCPA

7611 DCPA

0 to +70

8 Ld PDIP

E8.3

ICL7611DCPAZ (Note)

7611 DCPAZ

0 to +70

8 Ld PDIP* (Pb-free)

E8.3

ICL7612BCPA

7612 BCPA

0 to +70

8 Ld PDIP

E8.3

ICL7612BCPAZ

7612 BCPAZ

0 to +70

8 Ld PDIP* (Pb-free)

E8.3

ICL7612DCBA

7612 DCBA

0 to +70

8 Ld SOIC (150 mil)

M8.15

ICL7612DCBA-T

7612 DCBA

0 to +70

8 Ld SOIC (150 mil) Tape and Reel

M8.15

ICL7612DCBAZ (Note)

7612 DCBAZ

0 to +70

8 Ld SOIC (150 mil) (Pb-free)

M8.15

ICL7612DCBAZ-T (Note)

7612 DCBAZ

0 to +70

8 Ld SOIC (150 mil) Tape and Reel (Pb-free)

M8.15

ICL7612DCPA

7612 DCPA

0 to +70

8 Ld PDIP

E8.3

ICL7612DCPAZ (Note)

7612 DCPAZ

0 to +70

8 Ld PDIP* (Pb-free)

E8.3

*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are

MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.