ISL54500

FN6549 Rev 2.00

Page 13 of 13

November 9, 2009

Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)

B

D

A

E

0.10C

2X

PIN 1

TOP VIEW

0.10C

2X

REFERENCE

DETAIL A

0.10C

0.08C

7X

A3

A1

A

C

SEATING

PLANE

5X

L

e

1

3

64

4X

BOTTOM VIEW

SIDE VIEW

0.10 CA B

0.05C

b6X

NOTE 3

L1

DETAIL A

DETAIL B PIN 1 LEAD

0.1x45°

CHAMFER

DETAIL B

A3

A1

1.40

LAND PATTERN

1.00

0.30

0.35

0.20

0.45

0.40

0.20

10

L6.1.2x1.0A

6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMI-

NAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

5

D

0.95

1.00

1.05

-

E

1.15

1.20

1.25

-

e

0.40 BSC

-

L

0.30

0.35

0.40

-

L1

0.40

0.45

0.50

-

N

6

2

Ne

3

3



0-

12

4

Rev. 2 8/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-

1994.

2. N is the number of terminals.

3. Ne refers to the number of terminals on E side.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is

measured between 0.15mm and 0.30mm from the

terminal tip.

6. The configuration of the pin #1 identifier is optional, but

must be located within the zone indicated. The pin #1

identifier may be either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. JEDEC Reference MO-255.

10. For additional information, to assist with the PCB Land

Pattern Design effort, see Intersil Technical Brief TB389.