2

Micro Tilt Sensor

D6B

Operation

Installation

■ Terminal Arrangement

■ Solder Conditions

Reflow (Infrared) Soldering Conditions*

Weld a thermocouple on the terminal side of the Sensor with HMP

(high melting point) solder, place the Sensor into the reflow oven and

set the reflow oven so that the peak terminal temperature will be

230°C ± 5°C. Complete soldering within 20 seconds.

The peak terminal temperature must not exceed 240°C.

Desoldering Conditions with Blower

Employed

Desolder the Sensor at a temperature of 240°C within five seconds.

If a soldering iron is applied manually, desolder the Sensor within 10

seconds at an iron tip temperature of 260°C or within three seconds

at an iron tip temperature of 350°C.

* Preheat temperature = 140°C max. for 90 ± 30 seconds.

Dimensions

Unit: mm (inch)

Horizontal state

Return

Operation

High

High

High

High

Low

Low

Direction of gravity

Return

Operation

θ

θ

Horizontal state

Back and forth tilt

Left and right tilt

Top View

Note: 1. Operation angle: Output goes from High to

Low

2. Return angle: Output goes from Low to High

3. Characteristic values are provided on condi-

tion that there is no tilt back and forth while

the operation speed is 10° per second.

Out 1

Out 2

GND

Bottom View

6.4 (0.25)

5.5 (0.22)

1.7

(0.07)

3-0.2

5.5

(0.22)

3.7 (0.15)

3.65

(0.14)

1.605±0.15

(0.06±0.006)

1.65±0.15

(0.06±0.006)

3.1±0.1

(0.12±0.004)

0.95

(0.037)

0.95 (0.037)

0.3 (0.012)

0.25

(0.010)

0.4

(0.016)

0.7

(0.028)

0.7 (0.028)

3.5

(0.138)

3.5

(0.138)

1

(0.039)

1.4 (0.055)

1.4 (0.055)

0.9

(0.035)

3.5±0.1

(0.14±0.004)

0.9

(0.035)