Electronic Components Datasheet Search
  English  ▼

X  

Preview PDF HTML

LTC3770EG Datasheet(PDF) 21 Page - Linear Technology

Part # LTC3770EG
Description  Synchronous Controller with Margining, Tracking and PLL
PDF  24 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC3770EG Datasheet(HTML) 21 Page - Linear Technology

Back Button LTC3770EG Datasheet HTML 16Page - Linear Technology LTC3770EG Datasheet HTML 17Page - Linear Technology LTC3770EG Datasheet HTML 18Page - Linear Technology LTC3770EG Datasheet HTML 19Page - Linear Technology LTC3770EG Datasheet HTML 20Page - Linear Technology LTC3770EG Datasheet HTML 21Page - Linear Technology LTC3770EG Datasheet HTML 22Page - Linear Technology LTC3770EG Datasheet HTML 23Page - Linear Technology LTC3770EG Datasheet HTML 24Page - Linear Technology  
Zoom Inzoom in Zoom Outzoom out
 21 / 24 page
background image
21
LTC3770
3770f
To set a ±25% margining, select the resistors R3, R4 such
that
VREFIN = 0.6 ±25% • 0.6
or
118
3
4
25
0 6
.•
%• .
R
R
=
R4 ≈ 8R3
Choose R3 to be 10k, R4 to be 82k for this application.
PC Board Layout Checklist
When laying out a PC board follow one of two suggested
approaches. The simple PC board layout requires a dedi-
cated ground plane layer. Also, for higher currents, it is
recommended to use a multilayer board to help with heat
sinking power components.
• The ground plane layer should not have any traces and
it should be as close as possible to the layer with power
MOSFETs.
• Place CIN, COUT, MOSFETs, D1 and inductor all in one
compact area. It may help to have some components on
the bottom side of the board.
• Use an immediate via to connect the components to
ground plane including SGND and PGND of LTC3770.
Use several bigger vias for power components.
• Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
• Use planes for VIN and VOUT to maintain good voltage
filtering and to keep power losses low.
• Flood all unused areas on all layers with copper. Flood-
ing with copper will reduce the temperature rise of
power component. You can connect the copper areas to
any DC net (VIN, VOUT, GND or to any other DC rail in
your system).
Figure 12. Design Example: 2.5V/10A at 450kHz
3770 F12
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RUN
VON
PGOOD
VRNG
VFB
ITH
SGND
MARGIN1
MARGIN0
ION
VREFIN
VREFOUT
MPGM
TRACK/SS
RUN
FCB
Z0
BOOST
TG
SW
PGND
BG
INTVCC
Z1
Z2
ZVIN
VIN
PLLIN
PLLFLTR
INTVCC
5V
LTC3770EG
L1: SUMIDA CEP125-1R8MC-H
COUT: CORNELL DUBILIER ESRE181E04B
CIN: UNITED CHEMICON THCR60E1H106ZT
R6
11k
R5
39k
RC
20k
R3
10k
R2
95.3k
RON
75k
R4
82k
RPG
100k
CC1
500pF
CC2
100pF
CSS
0.1µF
CVCC
10µF
CVIN
0.1µF
DB
CMDSH-3
D1
B340A
+
COUT3
23µF
x5R
x2
COUT1-2
180µF
4V
x2
VOUT
2.5V
10A
VIN
5V TO 28V
+
CIN
10µF
50V
x3
CB
0.22µF
M1
Si4884
L1
1.8µH
M2
Si4874
+
R1
30.1k
R8
51k
R7
47k
APPLICATIO S I FOR ATIO



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com