FDC6330L datasheet(2/4 Pages) ONSEMI

2 / 4 page

Electrical Characteristics

TA=25

oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

OFF Characteristics

IFL

Leakage Current

VIN = 20 V, VON/OFF = 0 V

µA

ON Characteristics

(Note 3)

VIN = 12 V, VON/OFF = 3.3 V, IL = 2.5 A

0.2

VDROP

Conduction Voltage

VIN = 5 V, VON/OFF = 3.3 V, IL = 1.6 A

0.2

R(ON)

Q2 - Static On-Resistance

VGS = -12 V, ID = -2.3 A

VGS = -5 V, ID = -1.9 A

0.054

0.081

0.08

0.125

Ω

VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V

2.5

Load Current

VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V

1.6

Notes:

1. Range of V

can be up to 30V, but R

and R

must be scaled such that V

of Q2 does not exceed 20V.

2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting

surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user’s board design.

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDC6330L Load Switch Application

External Component Recommendation:

For applications where Co

≤ 1µF.

For slew rate control, select R2 in the range of 1k - 4.7k

Ω .

For additional in-rush current control,C1

≤ 1000pF can be added.

Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.

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