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FPF2193 Datasheet(PDF) 13 Page - ON Semiconductor |
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FPF2193 Datasheet(HTML) 13 Page - ON Semiconductor |
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13 / 14 page ![]() www.onsemi.com 13 Physical Dimensions Figure 29. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP) D E X Y 1.480±0.030 0.980±0.030 0.240 0.240 BOTTOM VIEW SIDE VIEWS RECOMMENDED LAND PATTERN BALL A1 INDEX AREA SEATING PLANE A1 F (NSMD PAD TYPE) (Ø0.350) SOLDER MASK OPENING (X) ±0.018 (Y) ±0.018 (Ø0.250) Cu Pad 0.06 C 0.05 C E D F NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC006AFrev2. 0.03 C 2X 0.03 C 2X Ø0.315 +/- .025 6X 1 2 A B C 0.332±0.018 0.250±0.025 D E (1.00) (0.50) 0.005 C A B 0.50 0.50 1.00 0.625 0.539 TOP VIEW B A C |
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