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MMRF1312GS Datasheet(PDF) 6 Page - NXP Semiconductors

Part # MMRF1312GS
Description  RF Power LDMOS Transistors
PDF  15 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MMRF1312GS Datasheet(HTML) 6 Page - NXP Semiconductors

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RF Device Data
Freescale Semiconductor, Inc.
MMRF1312H MMRF1312HS MMRF1312GS
TYPICAL CHARACTERISTICS — 1030 MHz
NARROWBAND PRODUCTION TEST FIXTURE
Pout, OUTPUT POWER (WATTS) PEAK
Figure 6. Power Gain and Drain Efficiency
versus Output Power
22
30
100
21
20
80
60
50
40
D
14
1000
Gps
18
19
16
17
15
70
30
20
10
VDD =50 Vdc,IDQ(A+B) = 100 mA, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
0
P3dB
(W)
60
29
56
54
Pin, INPUT POWER (dBm) PEAK
Figure 7. Output Power versus Input Power
58
50
48
52
31
33
35
37
39
41
43
45
46
62
1030
1002
1115
f
(MHz)
P1dB
(W)
VDD =50 Vdc,IDQ(A+B) = 100 mA, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
14
22
30
0
80
100
60
50
Pout, OUTPUT POWER (WATTS) PEAK
Figure 8. Power Gain versus Output Power
21
1000
300 mA
40
20
18
VDD = 50 Vdc, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
19
16
17
15
70
30
20
10
100 mA
500 mA
14
22
30
100
Pout, OUTPUT POWER (WATTS) PEAK
Figure 9. Power Gain versus Output Power
21
1000
VDD =30 V
20
18
IDQ(A + B) = 100 mA, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
19
16
17
15
10
12
13
11
35 V
35 V
40 V
45 V
50 V
Pin, INPUT POWER (dBm) PEAK
Figure 10. Output Power versus Input Power
29
TC = –40_C
VDD =50 Vdc,IDQ(A=B) = 100 mA, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
25_C
0
200
400
600
800
1000
1200
1400
31
33
35
37
39
41
43
45
25_C
85_C
24
30
0
80
100
60
50
Pout, OUTPUT POWER (WATTS) PEAK
Figure 11. Power Gain and Drain Efficiency versus
Output Power
D
1000
85_C
TC = –40_C
40
22
20
VDD =50 Vdc,IDQ(A+B) = 100 mA, f = 1030 MHz
Pulse Width = 128 sec, Duty Cycle = 10%
18
70
30
20
10
25_C
Gps
16
14
12
8
10
85_C
25_C
IDQ(A+B) = 700 mA
TC = –40_C



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