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FPF2595 Datasheet(PDF) 2 Page - ON Semiconductor |
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FPF2595 Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 11 page ![]() March 2016 © 2015 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2595 • Rev. 1.4 FPF2595 IntelliMAX™ 28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control Features V IN: 2.5 V~5.5 V 28 V Absolute Ratings at V OUT Current Capability: 3.9 A - Typ 0.1 A~3.5 A with 10% Accuracy R ON: Typ. 35 m Ω & Max. 50 mΩ at 5 VIN and 1 A IOUT Output OVP: Min.=5.6 V, Typ.=5.8 V, Max.=6 V No Output Discharge During Off State Open-Drain OCP on FLAGB Thermal Shutdown Under-Voltage Lockout (UVLO) True Reverse-Current Blocking (TRCB) Logic CMOS IO Meets JESD76 Standard for GPIO Interface and Related Power Supply Requirements ESD Protected: - Human Body Model: >2 kV - Charged Device Model: >1.0 kV - IEC 61000-4-2 Air Discharge: >15 kV - IEC 61000-4-2 Contact Discharge: >8 kV Applications Type C Power Source Switch Computing, Monitor Portable Devices Description The FPF2595 advanced load-management switch targets applications requiring a highly integrated solution. It disconnects loads powered from the DC power rail (<6 V) with stringent off-state current targets and high load capacitances (<100 µF). The FPF2595 consists of a slew-rate controlled low- impedance MOSFET switch (35 mΩ typical) and integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. FPF2595 has over-voltage protection and over- temperature protection. The FPF2595 has a True Reverse-Current Blocking (TRCB) function that obstructs unwanted reverse current from VOUT to VIN during ON and OFF states. The exceptionally low off-state current drain (<2 µA maximum) facilitates compliance with standby power requirements. The input voltage range operates from 2.5 V to 5.5 VDC to support a wide range of applications in consumer, optical, medical, storage, portable, and industrial-device power management. Switch control is managed by a logic input (active HIGH) capable of interfacing directly with low-voltage control signal / General-Purpose Input / Output (GPIO) without an external pull-down resistor. The device is packaged in advanced, fully “green” compliant, 1.3 mm x 1.8 mm, Wafer-Level Chip-Scale Packages (WLCSP). Ordering Information Part Number Operating Temperature Range Package Packing Method Top Mark FPF2595UCX -40 to 85°C 12-Ball, WLCSP, 3x4 Array, 0.4 mm Pitch, 250 µm Ball, Wafer-Level Chip-Scale Package (WLCSP) Tape & Reel TY |
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