Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Apr., 2014

APW7212

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VIN Supply Voltage (VIN to GND)

-0.3 ~ 7

V

VOUT to GND Voltage

-0.3 ~ 7

V

SW to GND Voltage

-0.3 ~ 7

V

FB, EN and PS to GND Voltage

-0.3 ~ 7

V

Maximum Junction Temperature

150

°C

Storage Temperature

-65 ~ 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

TDFN2x2-8

TSOT-23-6A

85

220

°C/W

Note 2:

θ

of package is soldered directly on the PCB.

Thermal Characteristics

Package Code

QB : TDFN2x2-8 CT : TSOT-23-6A

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G: Halogen and Lead Free Device

X - Date Code

APW7212

Handling Code

Temperature Range

Package Code

Assembly Material

APW7212 QB:

7212

X

X - Date Code

APW7212 CT:

W12X