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APX8131 Datasheet(PDF) 2 Page - Anpec Electronics Coropration

Part # APX8131
Description  Hall Effect Micro Switch IC
PDF  12 Pages
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Manufacturer  ANPEC [Anpec Electronics Coropration]
Direct Link  http://www.anpec.com.tw
Logo ANPEC - Anpec Electronics Coropration

APX8131 Datasheet(HTML) 2 Page - Anpec Electronics Coropration

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Copyright
© ANPEC Electronics Corp.
Rev. A.1- Aug., 2014
APX8131
www.anpec.com.tw
2
APX8131
Symbol
Characteristic
Test Conditions
Min.
Typ.
Max.
Unit
VDD
Supply Voltage Range
Operating
2.5
-
3.5
V
Average
-
5
10
µA
Awake
-
1.2
2
mA
IDD
Supply Current
Sleep
-
2
8
µA
IOFF
Output Leakage Current
VOUT = 3.5V, BRPN<B<BRPS
-
-
1.0
µA
VOL
Output Low Voltage
ISINK = 1mA
-
20
40
mV
tawake
Wake Up Time
-
180
-
µs
tperiod
Period
-
60
120
ms
d.c.
Duty Cycle
-
0.3
-
%
fc
Chopping Frequency
-
11
-
kHz
Symbol
Parameter
Rating
Unit
VDD
Supply Voltage
5
V
VOUT
Output Voltage
5
V
TJ
Junction Temperature Range
150
TSTG
Storage Temperature Range
-65 to +150
°C
Electrical Characteristics (T
A = 25°C, VDD=3V unless otherwise noted)
Absolute Maximum Ratings (T
A = 25°C unless otherwise noted)
(Note1)
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Symbol
Parameter
Typical Value
Unit
θ
JA
Junction-to-Ambient Resistance in Free Air
(Note 2)
SOT-23
260
οC/W
θ
JC
Junction-to-Case Resistance in Free Air
(Note 2)
SOT-23
145
οC/W
PD
Power Dissipation, TA=25
oC
SOT-23
0.385
W
Note 2:
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Thermal Characteristics



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