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SN74LVC1GX04DBVT Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1GX04DBVT Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 13 page ![]() SN74LVC1GX04 CRYSTAL OSCILLATOR DRIVER SCES581 − JULY 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D One Unbuffered Inverter (SN74LVC1GU04) and One Buffered Inverter (SN74LVC1G04) D Suitable for Commonly Used Clock Frequencies: − 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz, 25 MHz, 26 MHz, 27 MHz, 28 MHz D Max tpd of 2.4 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information The SN74LVC1GX04 is designed for 1.65-V to 5.5-V VCC operation. This device incorporates the SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single device. The LVC1GX04 is optimized for use in crystal oscillator applications. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC1GX04YEPR _ _ _ _ −40 C to 85 C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) Reel of 3000 SN74LVC1GX04YZPR _ _ _ _ −40 °C to 85°C SOT (SOT-23) − DBV Reel of 3000 SN74LVC1GX04DBVR CX4_ SOT (SOT-23) − DBV Reel of 250 SN74LVC1GX04DBVT CX4_ SOT (SC-70) − DCK Reel of 3000 SN74LVC1GX04DCKR D2_ SOT (SC-70) − DCK Reel of 250 SN74LVC1GX04DCKT D2_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV OR DCK PACKAGE (TOP VIEW) DNU − Do not use YEP OR YZP PACKAGE (BOTTOM VIEW) NC − No internal connection 1 2 3 6 5 4 NC GND X1 Y VCC X2 3 2 1 4 5 6 X1 GND DNU X2 VCC Y NanoStar and NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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