4

Precision Edge™

SY89208V

Micrel

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

f

MAX

Max. Toggle Frequency

Note 7

3

——

GHz

t

pd

Propagation Delay (Differential)

SEL to Q, /Q; D to Q, /Q

170

230

420

ps

t

SKEW

Part-to-Part Skew

Note 8

——

200

ps

t

JITTER

Cycle-to-Cycle Jitter (rms)

Note 9

——

1ps

(rms)

Random Jitter

Note 10

——

1ps

(rms)

Deterministic Jitter

@1.25Gbps

Note 11

—

7

—

ps

(pk-pk)

@2.5Gbps

Note 10

—

10

—

ps

(pk-pk)

Total Jitter

Note 12

——

10

ps

(pk-pk)

V

IN

Differential Input Voltage Range

150

800

1200

mV

t

Output Rise/Fall Time

Q, /Q

90

140

200

ps

(20% to 80%)

Note 1.

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation

is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM

RATlNG conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

Note 4.

The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established.

Note 5.

Output loaded with 50

Ω to V

Note 6.

V

Note 7.

Measured with 750mV input signal, 50% duty cycle. Output swing

≥ 400mV. All loading with a 50Ω to V

Note 8.

Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are

measured from the cross point of the inputs to the cross point of the outputs.

Note 9.

rising edges of the output signal.

Note 10. Random jitter is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 2.5Gbps.

jitter value.

AC ELECTRICAL CHARACTERISTICS