ADCLK950 datasheet(5/12 Pages) AD

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Data Sheet

ADCLK950

Rev. B | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

CC − VEE

6 V

Input Voltage

CLK0, CLK1, CLK0, CLK1, IN_SEL

EE − 0.5 V to

CC + 0.5 V

CLK0, CLK1, CLK0, CLK1 to V

Tx Pin (CML,

LVPECL Termination)

±40 mA

CLK0, CLK1 to CLK0, CLK1

±1.8 V

Input Termination, V

Tx to CLK0, CLK1, CLK0,

and CLK1

±2 V

Maximum Voltage on Output Pins

CC + 0.5 V

Maximum Output Current

35 mA

Voltage Reference (V

REFx)

CC to VEE

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

J = TCASE + (ΨJT × PD)

where:

J is the junction temperature (°C).

CASE is the case temperature (°C) measured by the customer at

the top center of the package.

JT is from Table 6.

D is the power dissipation.

Values of θ

JA are provided for package comparison and PCB

design considerations. θ

JA can be used for a first-order approxi-

mation of T

J by the equation

J = TA + (θJA × PD)

where T

A is the ambient temperature (°C).

Values of θ

JB are provided in Table 6 for package comparison

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value

Unit

Junction-to-Ambient Thermal Resistance

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

46.1

°C/W

Moving Air

JMA

Per JEDEC JESD51-6

1 m/sec Air Flow

40.3

°C/W

2.5 m/sec Air Flow

36.2

°C/W

Junction-to-Board Thermal Resistance

Moving Air

Per JEDEC JESD51-8

1 m/sec Air Flow

28.7

°C/W

Junction-to-Case Thermal Resistance

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heatsink

8.3

°C/W

Junction-to-Top-of-Package Characterization Parameter

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

0.6

°C/W

1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine if they are similar to those assumed in these calculations.

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