MMPF0100Z datasheet(127/128 Pages) NXP

127 / 128 page

NXP Semiconductors

127

PF0100Z

REVISION HISTORY

4.0

4/2014

• Added new package name and drawing for PF0100AZ

• Added Table 2 listing differences between PF0100Z and PF0100AZ

• Corrected VDDOTP maximum rating

• Corrected SWBSTFB maximum rating

• Updated Table 8 to included PF0100AZ specifications

• Updated Figure 4

• Added note of FUSE_POR-XOR bit for PF0100AZ in OTP prototyping

• Corrected 2.0 MHz clock minimum specification from 1.85 MHz to 1.84 MHz in 16 MHz and 32 kHz

clocks

• Corrected inductor Isat for SW1ABC single phase mode from 4.5 A to 6.0 A

• Tightened accuracy specification in PFM mode for all the switching regulators

• Corrected typical efficiency specifications for all switching regulators

• Added note to clarify SWBST default operation in Auto mode

• Added current limit specifications for VGEN2, VGEN6, and VSNVS for PF0100AZ

• Corrected conditions for VSNVS turn-on time specifications

• Changed VTH1 maximum specification from 3.05 V to 3.1 V

• Updated Control interface I2C block description to include note about SCL/SDA drive strength

• Corrected default values of bits in INTMASK0 register in Table 118

• Corrected default value of 4 MSBs in Table 128

• Corrected default value of bits in SILICONREVID register in Table 126

• Updated Typical Application Schematic to add bypass capacitor on VDDIO pin

• Added capacitor at VDDIO pin in Bill of Material table

• Noted that voltage settings 0.6 V and below are not supported

• VSNVS Turn On Delay (td1) spec corrected from 15 ms to 5.0 ms

• Updated per GPCN 16220

5.0

10/2014

• Updated as per PB 16482

• Increased ambient operating temperature of MMPF0100NPAZES device

• Added additional specification line items for Standby current, Sleep current, and VREFDDR accuracy

for the extended temperature operation

• Added new part number MMPF0100F8AZES

• Updated Table 9

6.0

11/2014

• Corrected the temperature range for the device MMPF0100F8AZES in Table 1

• Updated Table 23

• Updated Bill of Materials Table 138

7.0

7/2015

• Added new part numbers MMPF0100F9AZES and MMPF0100FAAZES to Table 1

• Updated Table 9

8.0

10/2015

• Added MMPF0100F0AZES

to Table 1

• Updated Table 9

• Updated Table 52

• Updated Table 137

10/2015

• Fixed typo on page 1

9.0

12/2015

• Removed MMPF0100NPZES from Orderable part variations. No longer manufactured.

• Added MMPF0100F6AZES to Orderable part variations

• Updated Table 9 for MMPF0100F6AZES

10.0

3/2016

• Updated SW2 current capability from 2000 mA to 2500 mA for F9/FA versions

11.0

5/2016

• Changed Table 9 row - Default I2C Address from 0x80 to 0x08 for F0, F9, and FA

12.0

8/2016

• Added NP version to OTP's with SW2 current capability of 2500 mA

• Added BOM for SW1ABC

Revision

Date

Description of Changes

MMPF0100Z Datasheet(PDF) 127 Page - NXP Semiconductors

MMPF0100Z Datasheet(HTML) 127 Page - NXP Semiconductors

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